1805 Little Orchard St Suite 149 | San Jose, CA 95125 | 408.799.8936
Wafer And Optical Component Dicing
Currently processing up to 200mm silicon wafers and 7" square glass plates. We are an innovative company and pride ourselves
on the quality of our work. We have quick turnaround times because we understand our customers needs and value their business. If you have
had issues with other dicing service providers, or are tired of long lead times, please give us a call. You
won't be disappointed.
If you would like to discuss your application or have any questions, please call or email us.
Quick Turnaround Times
Large Blade Inventory
Located In Silicon Valley
Dicing Plus can route small precise circles and irregular shapes from various materials.