1805 Little Orchard St Suite 149 | San Jose, CA 95125 | 408.799.8936

Wafer And Optical Component Dicing


Currently processing up to 200mm silicon wafers and 7" square glass plates. We are an innovative company and pride ourselves on the quality of our work. We have quick turnaround times because we understand our customers needs and value their business. If you have had issues with other dicing service providers, or are tired of long lead times, please give us a call. You won't be disappointed.

If you would like to discuss your application or have any questions, please call or email us.

  •  Competitive Prices
  •  Quick Turnaround Times
  •  Quality Workmanship
Plate on UV Table
  •  Large Blade Inventory
  •  Experienced Staff
  •  Located In Silicon Valley
Diced Alumina Triangles
 

CNC Micro-Routing


Dicing Plus can route small precise circles and irregular shapes from various materials.

  •  CNC Micro Machining
  •  Minimal Chipping
  •  Precision Milling, Routing, & Drilling
  •  R&D Projects
  •  Local Pickup and Delivery Available


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